PART |
Description |
Maker |
DS42515 AM29DL164D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
DS42516 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
AM41DL32X4G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION
|
AM50DL128CH70IS AM50DL128CH70IT AM50DL128CH85IS AM |
STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM
|
AMD[Advanced Micro Devices]
|
AM45DL3208GT70IS AM45DL3208GT85IS AM45DL3208GT70IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices, Inc. ADVANCED MICRO DEVICES INC
|
M6MGD13VW34DWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGE13VW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGD13VW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGB64BM34CWG M6MGT64BM34CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
S71WS512ND0BAWAN3 S71WS512ND0BAWAP0 S71WS256ND0BAW |
Stacked Multi-Chip Product (MCP) Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
http:// SPANSION[SPANSION] Spansion, Inc.
|
AM45DL32X8G AM45DL3238GB85IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM SPECIALTY MEMORY CIRCUIT, PBGA73
|
ADVANCED MICRO DEVICES INC
|
AM49LV6408MT15I AM49LV4608MT15IS AM49LV4608MT15IT |
Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) 堆叠式多芯片封装(MCP64兆位个M × 16位)闪存兆位(为512k × 16位) Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) pseudo Static RAM 堆叠式多芯片封装(MCP64兆位个M × 16位)闪存兆位(为512k × 16位)伪静态存储器 Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) pseudo Static RAM 堆叠式多芯片封装(MCP4兆位个M × 16位)闪存兆位(为512k × 16位)伪静态存储器
|
Spansion, Inc. Spansion Inc.
|